- To build high-performance, ultra-low power chip for a tech customer
-
Deliver the AI chip within 6 to 9 months, followed by volume production
Key ASIC Bhd, listed on Bursa Malaysia announced it has been awarded of a US$3.1 million (RM13.1 million) AI chip design contract from a leading tech company, which is an existing customer. It declined to name the customer citing NDA. The company touts this latest win as affirming Key ASIC’s leadership position as a provider of high-performance, ultra-low power AI chips — critical building blocks for the next generation of smart, connected devices.
Key ASIC expects to deliver the AI chip within 6 to 9 months, followed by volume production — unlocking recurring revenue potential. It is designed with a minimum 5-year product lifespan.
“Our strength lies in delivering exactly what the AI market needs — high-performance, ultra- low power chips that enable smarter, faster, and more energy-efficient devices,” said Eg Kah Yee (pic), Chairman of Key ASIC. “This deal reflects the trust leading tech leaders place in Key ASIC’s design capabilities and positions us at the forefront of AI innovation,” he added, confident that the deal gives Key ASIC’s a foothold in the booming global AI and IoT semiconductor markets while reinforcing it as a design partner.
The AI chip is engineered to deliver exceptional performance at ultra-low power consumption, addressing one of the most critical demands in AI and Edge computing: maximizing computing power while minimizing energy usage.
With AI and IoT reshaping industries — from smart cities and intelligent infrastructure to healthcare, automation, and consumer devices — the demand for energy-efficient, high- performance AI chips has never been higher, says the company which has adopted a “Building the Brains Behind the AI Revolution,” tagline.
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To build high-performance, ultra-low power chip for a tech customer
Deliver the AI chip within 6 to 9 months, followed by volume production
Key ASIC Bhd, listed on Bursa Malaysia announced it has been awarded of a US$3.1 million (RM13.1 million) AI chip design contract from a leading tech company, which is an existing customer. It declined to name the customer citing NDA. The company touts this latest win as affirming Key ASIC’s leadership position as a provider of high-performance, ultra-low power AI chips — critical building blocks for the next generation of smart, connected devices.
Key ASIC expects to deliver the AI chip within 6 to 9 months, followed by volume production — unlocking recurring revenue potential. It is designed with a minimum 5-year product lifespan.
“Our strength lies in delivering exactly what the AI market needs — high-performance, ultra- low power chips that enable smarter, faster, and more energy-efficient devices,” said Eg Kah Yee (pic), Chairman of Key ASIC. “This deal reflects the trust leading tech leaders place in Key ASIC’s design capabilities and positions us at the forefront of AI innovation,” he added, confident that the deal gives Key ASIC’s a foothold in the booming global AI and IoT semiconductor markets while reinforcing it as a design partner.
The AI chip is engineered to deliver exceptional performance at ultra-low power consumption, addressing one of the most critical demands in AI and Edge computing: maximizing computing power while minimizing energy usage.
With AI and IoT reshaping industries — from smart cities and intelligent infrastructure to healthcare, automation, and consumer devices — the demand for energy-efficient, high- performance AI chips has never been higher, says the company which has adopted a “Building the Brains Behind the AI Revolution,” tagline.
Related Articles
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IC design
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AI Chip
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Ultra Low Power
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